Features of PMT Package Foundry
PMT Package Foundry is specialized in low-volume or trial production of FOWLP (Fan Out Wafer Level Package) or WLCSP (Wafer Level Chip Scale Package).
Because we use an appropriate amount of IC chip, the entire wafer is not required.
Furthermore, fine and flexible wiring is available since we produce package by using redistribution layer (RDL) technology.
We propose RDL packages with various functions such as heterogeneous integration SiP and extremely thin packages. Please feel free to contact us!
●Improvement of Signal Integrity
Reduction of electric resistance and parasitic capacitance with RDL helps better signal integrity
●Improvement of Heat Dissipation
Lower thermal resistance and better heat dissipation because of thinner package.
▲FOWLP 84pin Daisy Chain (TEG)
●Comparison of Package Structure
Prototype Various Types of Packages
We provide 4 types of packages with using RDL technology of PMT foundry.
Available package types and its representative applications are shown in following table. Please feel free to contact us from inquiry form!
（Fan-Out Wafer Level Package）
（Wafer Level Chip Scale Package）
（System in Package）
（Double-Sided Electrode Package）
|Medical Module||Sensor System||Image Sensor|
Process Design Rule Overview
|Solder Ball||Ball Size||Material||Ball Pitch|
|Cu Redistribution Layer||Layer Thickness||Line Width||Rs|
*Values in above table is as of January 2021. Please feel free to contact us for the latest information.
Please contact us from here for inquiry regarding package specifications and production costs.
For smooth exchange, we recommend you to choose “Foundry” in a question of “Which Items Are You Interested In?”