Package on IC Chip without Bump!
We Provide a low-profile package 80µm or less!
Features of PMT Foundry
PMT Foundry offers excellent value in speed, economy, and flexibility.
Providing thinner package in a short time, development time can be shortened.
Both electronic substrate and photomask are not required because of using mask-less exposure.
Using a mask-less exposure system, designing RDL pattern becomes more flexible.
Flexible Process Design!
We flexibly respond to customer’s requests by using packaging and plating technology with high process integration capability and wide experience.
● KGD without solder bump can be accepted.
● PMT Foundry easily supports MOA orders with few IC dies.
● Low-profile package because of no electronic substrate.
● Signal Integrity
Reduction of electric resistance and parasitic capacitance with RDL helps better signal integrity.
● Heat Dissipation
Lower thermal resistance and better heat dissipation because of thinner package.
● Extremely Thin Package
Capable to expose the back side of IC die embedded in mold resin.
Prototype Various Types of Packages
We provide 3 types of package using Cu RDL technology.
All package types are flexible design according to customer’s purposes and specifications.
Package types that PMT has provided, or can be provided, with their typical applications are shown in following table.
Please feel free to contact us from the inquiry form!
(Fan Out Wafer Level Package)
(Wafer Level Chip Scale Package)
(System in a Package)
|Medical Module||Sensor System|
Process Design Rule Overview
|Solder Ball||Ball Size||Material||Ball Pitch|
|Cu Redistribution Layer||Layer Thickness||Line Width||Rs|
*Values in above table is as of April 2020. Please feel free to contact us for the latest information.
Please contact us from here for inquiry regarding package specifications and production costs.
For smooth exchange, we recommend you to choose "Foundry" in a question of "Which Items Are You Interested In?"